Contribution
Investigation into the Numerical Simulation of Headphones
* Presenting author
Abstract:
Numerical simulations allow the evaluation of high-frequency behavior of headphones compared to classical simulation methods with equivalent circuits, as acoustic and mechanical wave propagation is modelled. However, reliable simulation results require a correct modelling of the coupling between different physical domains, materials and complex geometries. Therefore, this work developed simulation models with increasing levels of complexity and compared them with measurements. The combination of a transducer model based on lumped small-signal parameters with acoustic finite elements has proven to be an efficient approach for predicting the electroacoustic behavior of the transducer in free-field conditions, as well as for simplified headphone models on a measurement coupler. Furthermore, the ear pad is modelled as an equivalent fluid, where an impedance tube method is used for parameter estimation. While simulations largely align with measurements, accuracy of the ear pad model is limited in the bass frequency range. The developed models facilitate the analysis and optimization of wave propagation in headphones and provide a foundation for further increasing model complexity.